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Conferences & Workshops

Conferences & Workshops

International 3D-MID (Molded Interconnect Device) Technology Workshop

February 07, 2018

 

International 3D-MID (Molded Interconnect Device) Technology Workshop was co-hosted by Feng Chia University and Friedrich-Alexander-Universität Erlangen-Nürnberg (2015). 3D-MID is a 3-dimenional injection-molded thermoplastic part with integrated electronic circuit traces. It is a technology often applied to wearable electronic devices. Keynote speakers from Germany were invited to share the state-of-the-art 3D-MID technology with the academia and industry of Taiwan, attracting more than a hundred participants.

 

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